PHANI SURESH PALADUGU. Hybrid 2.5D/3D Integration of Photonic Chiplets and Compute Dies for Scalable Co-Packaged Optical Interconnects in AI Data Centers. The American Journal of Engineering and Technology, [S. l.], v. 8, n. 03, p. 1–19, 2026. DOI: 10.37547/tajet/Volume08Issue03-01. Disponível em: https://www.theamericanjournals.com/index.php/tajet/article/view/7531. Acesso em: 9 mar. 2026.