Phani Suresh Paladugu 2026. Hybrid 2.5D/3D Integration of Photonic Chiplets and Compute Dies for Scalable Co-Packaged Optical Interconnects in AI Data Centers. The American Journal of Engineering and Technology. 8, 03 (Mar. 2026), 1–19. DOI:https://doi.org/10.37547/tajet/Volume08Issue03-01.